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Henkel Canada Corp. (Loctite)
BERGQUIST GAP PAD TGP HC5000
BERGQUIST GAP PAD TGP HC5000 is a silicone-based, thermally conductive, and highly conforming gap pad filler designed for high performance applications.
BERGQUIST GAP PAD TGP HC5000 is a silicone-based, thermally conductive, and highly conforming gap pad filler designed for high performance applications.
BERGQUIST® GAP PAD TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides that reduces the need for additional bulky adhesive layers and comes with protective liners on both side for easy handling.
Thermal Conductivity: 5.0 W/m-K
High-compliance, low compression stress
Fiberglass reinforced for shear and tear resistance
Silicone-based