Henkel Canada Corp. (Loctite)

BERGQUIST GAP PAD TGP EMI1000

BERGQUIST GAP PAD TGP EMI1000, Thermally Conductive, Conformable EMI Absorbing Material

BERGQUIST GAP PAD TGP EMI1000
BERGQUIST GAP PAD TGP EMI1000, Thermally Conductive, Conformable EMI Absorbing Material
BERGQUIST® GAP PAD® TGP EMI1000 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies of 1GHz and higher. The material offers EMI suppression and 1.0 W/m-K thermal conductivity performance with low assembly stress. The soft nature of the material enhances wet-out at the interface resulting in better thermal performance than harder materials with a similar performance rating. Options and Configurations Standard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125" Custom made configurations available upon request
 
Thermal Conductivity: 1.0 W/m-K
Electromagnetic Interference (EMI) absorbing
Highly conformable, low hardness
Fiberglass reinforced for puncture, shear and tear resistance