BERGQUIST GAP PAD TGP HC5000

BERGQUIST GAP PAD TGP HC5000 is a silicone-based, thermally conductive, and highly conforming gap pad filler designed for high performance applications.

BERGQUIST® GAP PAD TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides that reduces the need for additional bulky adhesive layers and comes with protective liners on both side for easy handling.

 

Thermal Conductivity: 5.0 W/m-K

High-compliance, low compression stress

Fiberglass reinforced for shear and tear resistance

Silicone-based