BERGQUIST TGR 4000

BERGQUIST TGR 4000, High Performance Thermal Interface Compound for Copper-Based Heat Sinks

BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based heat sink. Other high watt density applications will benefit from the extremely low thermal impedance of BERGQUIST TGR 4000. The BERGQUIST TGR 4000 compound wets-out the thermal interface surfaces and flows to produce low thermal impedance. The compound requires pressure of the assembly to cause flow. BERGQUIST TGR 4000 compound will not drip. For a typical 0.5'' x 0.5'' application at 0.005'' thick, Bergquist estimates approximately 0.02 ml (cc) of BERGQUIST TGR 4000. Although BERGQUIST estimates a 0.02 ml (cc) volumetric requirement for a 0.5'' x 0.5'' component interface, dispensed at a thickness of 0.005'', BERGQUIST also recognizes that an optimized application would utilize the minimum volume of TICTM 4000 material necessary to ensure complete wet-out of both mechanical interfaces. Options and ConfigurationsContainers - 5cc, 25cc, 200cc Custom made configurations available upon request

 

Thermal conductivity: 4.0 W/m-K

Exceptional thermal performance: 0.19°C/W @ 50 psi