BERGQUIST GAP PAD TGP 3000

BERGQUIST GAP PAD TGP 3000 is a thermally conductive,reinforced and Soft “S-Class” Gap Filler for low stress sensitive applications.

BERGQUIST® GAP PAD TGP 3000 is a pre-cured silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear.It is also UL-94 V-0 compliant. This product is well suited for high performance, low stress sensitive applications.

 

Thermal conductivity: 3.0 W/m-K

Low "S-Class" thermal resistance at very low pressures

Highly conformable,"S-Class" softness

Designed for low-stress applications