BERGQUIST GAP FILLER TGF 1000SR

BERGQUIST GAP FILLER TGF 1000SR is a silicone based, thermally conductive, form in place gap filler with excellent slump resistance (SR) ideal for low stress interface applications.

BERGQUIST® GAP FILLER TGF 1000SR is a two component, thermally conductive, silicone-based liquid gap filler. This product exhibits excellent slump resistance. It can be cured at room temperature and the curing process can be accelerated with heat. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.

 

Thermal conductivity: 1.0 W/m-K

Excellent slump resistance (stays in place)

Ultra-conforming, with excellent wet-out for low stress interface applications

100% Solids – no cure by-products