BERGQUIST GAP PAD TGP 2000SF

BERGQUIST GAP PAD TGP 2000SF, Thermally Conductive, Silicone-Free Gap Filling Material

BERGQUIST® GAP PAD TGP 2000SF is a silicone-free insulating material. Silicone-sensitive applications benefit from this fiberglass-reinforced gap filling material, which combines electrical isolation with exceptional thermal performance (2.0 W/mK). While highly thermally conductive, the material is exceptionally soft and more compliant than other silicone-free materials. BERGQUIST GAP PAD TGP 2000SF is capable of conforming to the most demanding contours while applying little stress on component leads.

 

High Thermal Conductivity: 2 W/m-K

Natural inherent tack reduces interfacial thermal resistance and aids assembly

Conforms to demanding contours and maintains structural integrity with little stress applied to fragile component leads

Fiberglass reinforced for puncture, shear and tear resistance