BERGQUIST LIQUI FORM TLF LF2000

BERGQUIST LIQUI FORM TLF LF2000, Thermally Conductive, One-Part, Liquid Formable Material

BERGQUIST® LIQUI FORM TLF LF2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework. BERGQUIST LIQUI FORM TLF LF2000 is a highly conformable shear-thinning material which requires no curing, mixing or refrigeration. Its unique formulation assures excellent thermal performance, low applied stress and reliable long-term performance. BERGQUIST LIQUI FORM TLF LF2000 is thixotropic and has a natural tack ensuring it forms around the component and stays in place in the application.

 

Thermal Conductivity: 2.0 W/m-K

Applies very low force on components during assembly

Low volumetric expansion

Excellent chemical and mechanical stability even at higher temperatures