BERGQUIST GAP FILLER TGF 1500LVO

BERGQUIST GAP FILLER TGF 1500LVO is low outgassing, silicone based, liquid gap filler compatible for use with silicone-sensitive electronics.

BERGQUIST® GAP FILLER TGF 1500LVO is a two part, thermally conductive liquid gap filler that offers high temperature resistance and is proven to have significantly lower levels of silicone outgassing. BERGQUIST GAP FILLER TGF 1500LVO cures at room temperature or can be accelerated using heat and is ideal for applications that are fragile or do not require a strong bond due to a lower level of adhesion strength.

 

Thermal conductivity: 1.8 W/mK

Low volatility for silicone sensitive applications

Ultra-conforming, with excellent wet-out

100% solids — no cure by-products