BERGQUIST TGR 1500A

BERGQUIST TGR 1500A, High Performance, Value Compound for High-End Computer Processors

BERGQUIST® TGR 1500A is a high performance, thermally conductive compound intended for use as a thermal interface material between a high end computer processor and a heat sink. Other high watt density applications will also benefit from the extremely low thermal impedance of BERGQUIST TGR 1500A. BERGQUIST TGR 1500A compound wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The compound requires pressure of the assembly to cause flow. The BERGQUIST TGR 1500A compound will resist dripping. For microprocessor applications, traditional screw fastening or spring clamping methods will provide adequate force to optimize the thermal performance of BERGQUIST TGR 1500A. An optimized application would utilize the minimum volume of BERGQUIST TGR 1500A material necessary to ensure complete wet-out of both mechanical interfaces.

 

High thermal performance: 0.32ºC/W@ 50 psi

Good screenability

Room temperature storage

No post “cure” required