BERGQUIST GAP FILLER TGF 1000

BERGQUIST GAP FILLER TGF 1000 is a silicone based, thermally conductive and form in place gap filler ideal for fragile and low stress applications.

BERGQUIST® GAP FILLER TGF 1000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.

 

Thermal conductivity: 1.0 W/m-K

Ultra-conforming, designed for fragile and low-stress applications

Ambient and accelerated cure schedules

100% Solids – no cure by-products