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Henkel Canada Corp. (Loctite)
BERGQUIST GAP FILLER TGF 1100SF
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BERGQUIST GAP FILLER TGF 1100SF is a silicone free (SF), high-performance gap filler ideal for fragile and low stress applications.
BERGQUIST GAP FILLER TGF 1100SF is a silicone free (SF), high-performance gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 1100SF is a two component, thermally conductive, silicone free liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. It helps reduce thermal stresses during operation.
Thermal Conductivity: 1.1 W/m-k
No silicone outgassing or extraction
Ultra-conforming, designed for fragile and low-stress applications
Ambient and accelerated cure schedules