BERGQUIST GAP PAD TGP 6000ULM

BERGQUIST GAP PAD TGP 6000ULM is a high performance, silicone-based, ultra low modulus (ULM) gap pad filler with a thermal conductivity rating of 6.0 W/m-K.

BERGQUIST® GAP PAD TGP 6000ULM is an extremely soft, thermal interface material with a higher natural tack, thereby eliminating the need for additional adhesive layers and provides stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.

 

Thermal conductivity: 6 W/m-K

Excellent interfacing and wet-out characteristics

Supplied with protective liners for ease of use

UL94 V-0 compliance